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| author | Georgi Djakov <djakov@kernel.org> | 2021-12-06 19:53:06 +0200 |
|---|---|---|
| committer | Georgi Djakov <djakov@kernel.org> | 2021-12-06 19:53:06 +0200 |
| commit | 1f41badaf6932f13eebf711045a4ad387e60cb0b (patch) | |
| tree | 6a9f29f293babaf466f7d0b90a08f3c6d4950551 /net/lapb/lapb_subr.c | |
| parent | a7d9436a6c85fcb8843c910fd323dcd7f839bf63 (diff) | |
| parent | 7add937f5222fe9a04a2ca3c43a322985219711f (diff) | |
Merge branch 'icc-msm8996' into icc-next
This series adds a driver for interconnects on MSM8996. This fixes some rare display underflows
and provides a slight heat reduction.
* icc-msm8996
dt-bindings: interconnect: Combine SDM660 bindings into RPM schema
interconnect: icc-rpm: Add support for bus power domain
dt-bindings: interconnect: Add Qualcomm MSM8996 DT bindings
interconnect: qcom: Add MSM8996 interconnect provider driver
Link: https://lore.kernel.org/r/20211021132329.234942-1-y.oudjana@protonmail.com
Signed-off-by: Georgi Djakov <djakov@kernel.org>
Diffstat (limited to 'net/lapb/lapb_subr.c')
0 files changed, 0 insertions, 0 deletions