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authorGeorgi Djakov <djakov@kernel.org>2025-05-19 17:09:50 +0300
committerGeorgi Djakov <djakov@kernel.org>2025-05-19 17:09:50 +0300
commit5fed7fe33c2cd7104fc87b7bc699a7be892befa2 (patch)
tree0b5de5a07078060f964bd64bdead3893f4b5926a /net/lapb/lapb_timer.c
parentb0779ea486061a1756892f4ea43e258e5dd559cd (diff)
parentb1244645ad6c79d89974c015abe552d47a42dbdc (diff)
Merge branch 'icc-sa8775p' into icc-next
Add Epoch Subsystem (EPSS) L3 provider support on SA8775P SoCs. Current interconnect framework is based on static IDs for creating node and registering with framework. This becomes a limitation for topologies where there are multiple instances of same interconnect provider. Modified interconnect framework APIs to create and link icc node with dynamic IDs, this will help to overcome the dependency on static IDs. * icc-sa8775p dt-bindings: interconnect: Add EPSS L3 compatible for SA8775P interconnect: core: Add dynamic id allocation support interconnect: qcom: Add multidev EPSS L3 support interconnect: qcom: icc-rpmh: Add dynamic icc node id support interconnect: qcom: sa8775p: Add dynamic icc node id support Link: https://lore.kernel.org/r/20250415095343.32125-1-quic_rlaggysh@quicinc.com Signed-off-by: Georgi Djakov <djakov@kernel.org>
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