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2025-12-06Merge tag 'char-misc-6.19-rc1' of ↵Linus Torvalds
git://git.kernel.org/pub/scm/linux/kernel/git/gregkh/char-misc Pull char/misc/IIO driver updates from Greg KH: "Here is the big set of char/misc/iio driver updates for 6.19-rc1. Lots of stuff in here including: - lots of IIO driver updates, cleanups, and additions - large interconnect driver changes as they get converted over to a dynamic system of ids - coresight driver updates - mwave driver updates - binder driver updates and changes - comedi driver fixes now that the fuzzers are being set loose on them - nvmem driver updates - new uio driver addition - lots of other small char/misc driver updates, full details in the shortlog All of these have been in linux-next for a while now" * tag 'char-misc-6.19-rc1' of git://git.kernel.org/pub/scm/linux/kernel/git/gregkh/char-misc: (304 commits) char: applicom: fix NULL pointer dereference in ac_ioctl hangcheck-timer: fix coding style spacing hangcheck-timer: Replace %Ld with %lld hangcheck-timer: replace printk(KERN_CRIT) with pr_crit uio: Add SVA support for PCI devices via uio_pci_generic_sva.c dt-bindings: slimbus: fix warning from example intel_th: Fix error handling in intel_th_output_open misc: rp1: Fix an error handling path in rp1_probe() char: xillybus: add WQ_UNBOUND to alloc_workqueue users misc: bh1770glc: use pm_runtime_resume_and_get() in power_state_store misc: cb710: Fix a NULL vs IS_ERR() check in probe() mux: mmio: Add suspend and resume support virt: acrn: split acrn_mmio_dev_res out of acrn_mmiodev greybus: gb-beagleplay: Fix timeout handling in bootloader functions greybus: add WQ_PERCPU to alloc_workqueue users char/mwave: drop typedefs char/mwave: drop printk wrapper char/mwave: remove printk tracing char/mwave: remove unneeded fops char/mwave: remove MWAVE_FUTZ_WITH_OTHER_DEVICES ifdeffery ...
2025-11-19dt-bindings: interconnect: qcom,sm6350-rpmh: Add clocks for QoSLuca Weiss
Add the clocks for some interconnects to the bindings that are required to set up the QoS correctly. Update one of the examples to aggre2_noc to have an example with clocks. Also while we're at it, remove #interconnect-cells: true as that's already provided from qcom,rpmh-common.yaml. Reviewed-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org> Signed-off-by: Luca Weiss <luca.weiss@fairphone.com> Link: https://lore.kernel.org/r/20251114-sm6350-icc-qos-v2-1-6af348cb9c69@fairphone.com Signed-off-by: Georgi Djakov <djakov@kernel.org>
2025-11-19Merge branch 'icc-kaanapali' into icc-nextGeorgi Djakov
Add interconnect dt-bindings and driver support for Qualcomm Kaanapali SoC. * icc-kaanapali dt-bindings: interconnect: document the RPMh Network-On-Chip interconnect in Kaanapali SoC interconnect: qcom: add Kaanapali interconnect provider driver dt-bindings: interconnect: qcom-bwmon: Document Kaanapali BWMONs Link: https://lore.kernel.org/r/20251031-knp-interconnect-v4-0-568bba2cb3e5@oss.qualcomm.com Signed-off-by: Georgi Djakov <djakov@kernel.org>
2025-11-19dt-bindings: interconnect: qcom-bwmon: Document Kaanapali BWMONsAmir Vajid
Document the Kaanapali BWMONs, which have one instance per cluster of BWMONv4. Signed-off-by: Amir Vajid <amir.vajid@oss.qualcomm.com> Signed-off-by: Jingyi Wang <jingyi.wang@oss.qualcomm.com> Reviewed-by: Konrad Dybcio <konrad.dybcio@oss.qualcomm.com> Link: https://lore.kernel.org/r/20250924-knp-bwmon-v1-1-56a9cdda7d72@oss.qualcomm.com Signed-off-by: Georgi Djakov <djakov@kernel.org>
2025-11-17dt-bindings: Remove extra blank linesRob Herring (Arm)
Generally at most 1 blank line is the standard style for DT schema files. Remove the few cases with more than 1 so that the yamllint check for this can be enabled. Acked-by: Lee Jones <lee@kernel.org> Reviewed-by: Mathieu Poirier <mathieu.poirier@linaro.org> # remoteproc Acked-by: Georgi Djakov <djakov@kernel.org> Acked-by: Vinod Koul <vkoul@kernel.org> Acked-by: Andi Shyti <andi.shyti@kernel.org> Acked-by: Bartosz Golaszewski <bartosz.golaszewski@linaro.org> Acked-by: Jonathan Cameron <jonathan.cameron@huawei.com> Acked-by: Philipp Zabel <p.zabel@pengutronix.de> Acked-by: Uwe Kleine-König <ukleinek@kernel.org> # for allwinner,sun4i-a10-pwm.yaml Reviewed-by: Miquel Raynal <miquel.raynal@bootlin.com> # mtd Acked-by: Guenter Roeck <linux@roeck-us.net> Acked-by: Mark Brown <broonie@kernel.org> Acked-by: Greg Kroah-Hartman <gregkh@linuxfoundation.org> Acked-by: Sebastian Reichel <sebastian.reichel@collabora.com> Acked-by: Manivannan Sadhasivam <mani@kernel.org> # For PCI controller bindings Link: https://patch.msgid.link/20251023143957.2899600-1-robh@kernel.org Signed-off-by: Rob Herring (Arm) <robh@kernel.org>
2025-11-17dt-bindings: Update Krzysztof Kozlowski's emailKrzysztof Kozlowski
Update Krzysztof Kozlowski's email address to kernel.org account to stay reachable. Signed-off-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org> Link: https://patch.msgid.link/20251021095354.86455-2-krzysztof.kozlowski@linaro.org Signed-off-by: Rob Herring (Arm) <robh@kernel.org>
2025-10-31dt-bindings: interconnect: document the RPMh Network-On-Chip interconnect in ↵Raviteja Laggyshetty
Kaanapali SoC Document the RPMh Network-On-Chip Interconnect of the Kaanapali platform. Co-developed-by: Odelu Kukatla <odelu.kukatla@oss.qualcomm.com> Signed-off-by: Odelu Kukatla <odelu.kukatla@oss.qualcomm.com> Signed-off-by: Raviteja Laggyshetty <raviteja.laggyshetty@oss.qualcomm.com> Reviewed-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org> Link: https://lore.kernel.org/r/20251031-knp-interconnect-v4-1-568bba2cb3e5@oss.qualcomm.com Signed-off-by: Georgi Djakov <djakov@kernel.org>
2025-10-31dt-bindings: interconnect: add reg and clocks properties to enable QoS on ↵Odelu Kukatla
sa8775p Add 'reg' and 'clocks' properties to enable QoS configuration. These properties enable access to QoS registers and necessary clocks for configuration. QoS configuration is essential for ensuring that latency sensitive components such as CPUs and multimedia engines receive prioritized access to memory and interconnect resources. This helps to manage bandwidth and latency across subsystems, improving system responsiveness and performance in concurrent workloads. Both 'reg' and 'clocks' properties are optional. If either is missing, QoS configuration will be skipped. This behavior is controlled by the 'qos_requires_clocks' flag in the driver, which ensures that QoS configuration is bypassed when required clocks are not defined. Signed-off-by: Odelu Kukatla <odelu.kukatla@oss.qualcomm.com> Reviewed-by: Rob Herring (Arm) <robh@kernel.org> Link: https://lore.kernel.org/r/20251001073344.6599-2-odelu.kukatla@oss.qualcomm.com Signed-off-by: Georgi Djakov <djakov@kernel.org>
2025-09-12Merge branch 'icc-glymur' into icc-nextGeorgi Djakov
Add interconnect dt-bindings and driver support for Qualcomm's next gen compute SoC - Glymur. * icc-glymur dt-bindings: interconnect: document the RPMh Network-On-Chip interconnect in Glymur SoC interconnect: qcom: icc-rpmh: increase MAX_PORTS to support four QoS ports interconnect: qcom: add glymur interconnect provider driver Link: https://lore.kernel.org/r/20250814-glymur-icc-v2-0-596cca6b6015@oss.qualcomm.com Signed-off-by: Georgi Djakov <djakov@kernel.org>
2025-09-12dt-bindings: interconnect: Add OSM L3 compatible for QCS615 SoCRaviteja Laggyshetty
Add Operation State Manager (OSM) L3 interconnect provider binding for QCS615 SoC. As the OSM hardware in QCS615 and SM8150 are same, added a family-level compatible for SM8150 SoC. Signed-off-by: Raviteja Laggyshetty <raviteja.laggyshetty@oss.qualcomm.com> Reviewed-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org> Link: https://lore.kernel.org/r/20250819-talos-l3-icc-v3-1-04529e85dac7@oss.qualcomm.com Signed-off-by: Georgi Djakov <djakov@kernel.org>
2025-08-15dt-bindings: interconnect: document the RPMh Network-On-Chip interconnect in ↵Raviteja Laggyshetty
Glymur SoC Document the RPMh Network-On-Chip Interconnect in Glymur platform. Co-developed-by: Odelu Kukatla <odelu.kukatla@oss.qualcomm.com> Signed-off-by: Odelu Kukatla <odelu.kukatla@oss.qualcomm.com> Reviewed-by: "Rob Herring (Arm)" <robh@kernel.org> Signed-off-by: Raviteja Laggyshetty <raviteja.laggyshetty@oss.qualcomm.com> Link: https://lore.kernel.org/r/20250814-glymur-icc-v2-1-596cca6b6015@oss.qualcomm.com Signed-off-by: Georgi Djakov <djakov@kernel.org>
2025-07-29Merge tag 'soc-dt-6.17' of git://git.kernel.org/pub/scm/linux/kernel/git/soc/socLinus Torvalds
Pull SoC devicetree updates from Arnd Bergmann: "There are a few new variants of existing chips: - mt6572 is an older mobile phone chip from mediatek that was extremely popular a decade ago but never got upstreamed until now - exynos2200 is a recent high-end mobile phone chip used in a few Samsung phones like the Galaxy S22 - Renesas R-Car V4M-7 (R8A779H2) is an updated version of R-Car V4M (R8A779H0) and used in automotive applications - Tegra264 is a new chip from NVIDIA, but support is fairly minimal for now, and not much information is public about it There are five more chips in a separate branch, as those are new chip families that I merged along with the necessary infrastructure. New board support is not that exciting, with a total of 33 newly added machines here: - Evaluation platforms for the chips above, plus TI am62d2 and Sophgo sg2042 - Six 32-bit industrial boards based on stm32, imx6 and am33 chips, plus eight 64-bit rockchips rk33xx/rk35xx, am62d2, t527, imx8 and imx95 - Two newly added ASPEED BMC based motherboards, and one that got removed - Phones and Tablets based on 32-bit mt6572, tegra30 and 64-bit msm8976 SoCs - Three Laptops based on Mediatek mt8186 and Qualcomm Snapdragon X1 - A set-top box based on Amlogic meson-gxm Updates for existing machines are spread over all the above families. One notable change here is support for the RP1 I/O chip used in Raspberry Pi 5" * tag 'soc-dt-6.17' of git://git.kernel.org/pub/scm/linux/kernel/git/soc/soc: (606 commits) riscv: dts: sophgo: fix mdio node name for CV180X riscv: dts: sophgo: sophgo-srd3-10: reserve uart0 device riscv: dts: sophgo: add Sophgo SG2042_EVB_V2.0 board device tree riscv: dts: sophgo: add Sophgo SG2042_EVB_V1.X board device tree dt-bindings: riscv: add Sophgo SG2042_EVB_V1.X/V2.0 bindings riscv: dts: sophgo: add ethernet GMAC device for sg2042 riscv: dts: sophgo: Enable ethernet device for Huashan Pi riscv: dts: sophgo: Add mdio multiplexer device for cv18xx riscv: dts: sophgo: Add ethernet device for cv18xx riscv: dts: sophgo: sg2044: add pmu configuration riscv: dts: sophgo: sg2044: add ziccrse extension riscv: dts: sophgo: add zfh for sg2042 riscv: dts: sophgo: add ziccrse for sg2042 riscv: dts: sophgo: Add xtheadvector to the sg2042 devicetree riscv: dts: sophgo: sg2044: add PCIe device support for SG2044 riscv: dts: sophgo: sg2044: add MSI device support for SG2044 riscv: dts: sophgo: add reset configuration for Sophgo CV1800 series SoC riscv: dts: sophgo: add reset generator for Sophgo CV1800 series SoC dt-bindings: soc: sophgo: Move SoCs/boards from riscv into soc, add SG2000 riscv: dts: sophgo: sg2044: Add missing riscv,cbop-block-size property ...
2025-07-22Merge branch 'icc-milos' into icc-nextGeorgi Djakov
Add documentation and driver for the interconnect on the Milos SoC. * icc-milos dt-bindings: interconnect: document the RPMh Network-On-Chip Interconnect in Qualcomm Milos SoC interconnect: qcom: Add Milos interconnect provider driver Link: https://lore.kernel.org/r/20250709-sm7635-icc-v3-0-c446203c3b3a@fairphone.com Signed-off-by: Georgi Djakov <djakov@kernel.org>
2025-07-21dt-bindings: interconnect: document the RPMh Network-On-Chip Interconnect in ↵Luca Weiss
Qualcomm Milos SoC Document the RPMh Network-On-Chip Interconnect of the Milos (e.g. SM7635) SoC. Reviewed-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org> Signed-off-by: Luca Weiss <luca.weiss@fairphone.com> Link: https://lore.kernel.org/r/20250709-sm7635-icc-v3-1-c446203c3b3a@fairphone.com Signed-off-by: Georgi Djakov <djakov@kernel.org>
2025-07-18dt-bindings: interconnect: qcom,msm8998-bwmon: Allow 'nonposted-mmio'Konrad Dybcio
One of the BWMON instances on SM8750 requires that its MMIO space is mapped specifically with the nE memory attribute. Allow the nonposted-mmio property which instructs the OS to do so. Signed-off-by: Konrad Dybcio <konrad.dybcio@oss.qualcomm.com> Reviewed-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org> Link: https://lore.kernel.org/r/20250716-8750_cpubwmon-v4-1-12212098e90f@oss.qualcomm.com Signed-off-by: Georgi Djakov <djakov@kernel.org>
2025-07-18dt-bindings: interconnect: Add EPSS L3 compatible for QCS8300 SoCRaviteja Laggyshetty
Add Epoch Subsystem (EPSS) L3 interconnect provider binding for QCS8300 SoC. As the EPSS hardware in QCS8300 and SA8775P are same, added a family-level compatible for SA877P SoC. This shared fallback compatible allows grouping of SoCs with similar hardware, reducing the need to explicitly list each variant in the driver match table. Signed-off-by: Raviteja Laggyshetty <raviteja.laggyshetty@oss.qualcomm.com> Reviewed-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org> Link: https://lore.kernel.org/r/20250711102540.143-2-raviteja.laggyshetty@oss.qualcomm.com Signed-off-by: Georgi Djakov <djakov@kernel.org>
2025-07-18dt-bindings: interconnect: qcom: Remove double colon from descriptionLuca Weiss
No double colon is necessary in the description. Fix it for all bindings so future bindings won't have the same copy-paste mistake. Reported-by: Rob Herring <robh@kernel.org> Closes: https://lore.kernel.org/lkml/20250625150458.GA1182597-robh@kernel.org/ Signed-off-by: Luca Weiss <luca.weiss@fairphone.com> Reviewed-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org> Link: https://lore.kernel.org/r/20250717-bindings-double-colon-v1-2-c04abc180fcd@fairphone.com Signed-off-by: Georgi Djakov <djakov@kernel.org>
2025-07-07dt-bindings: interconnect: add mt7988-cci compatibleFrank Wunderlich
Add compatible for Mediatek MT7988 SoC with mediatek,mt8183-cci fallback which is taken by driver. Signed-off-by: Frank Wunderlich <frank-w@public-files.de> Acked-by: Rob Herring (Arm) <robh@kernel.org> Reviewed-by: AngeloGioacchino Del Regno <angelogioacchino.delregno@collabora.com> Acked-by: Georgi Djakov <djakov@kernel.org> Link: https://lore.kernel.org/r/20250706132213.20412-8-linux@fw-web.de Signed-off-by: AngeloGioacchino Del Regno <angelogioacchino.delregno@collabora.com>
2025-05-19Merge branch 'icc-sa8775p' into icc-nextGeorgi Djakov
Add Epoch Subsystem (EPSS) L3 provider support on SA8775P SoCs. Current interconnect framework is based on static IDs for creating node and registering with framework. This becomes a limitation for topologies where there are multiple instances of same interconnect provider. Modified interconnect framework APIs to create and link icc node with dynamic IDs, this will help to overcome the dependency on static IDs. * icc-sa8775p dt-bindings: interconnect: Add EPSS L3 compatible for SA8775P interconnect: core: Add dynamic id allocation support interconnect: qcom: Add multidev EPSS L3 support interconnect: qcom: icc-rpmh: Add dynamic icc node id support interconnect: qcom: sa8775p: Add dynamic icc node id support Link: https://lore.kernel.org/r/20250415095343.32125-1-quic_rlaggysh@quicinc.com Signed-off-by: Georgi Djakov <djakov@kernel.org>
2025-04-28dt-bindings: interconnect: Correct indentation and style in DTS exampleKrzysztof Kozlowski
DTS example in the bindings should be indented with 2- or 4-spaces and aligned with opening '- |', so correct any differences like 3-spaces or mixtures 2- and 4-spaces in one binding. While re-indenting, drop unused labels. No functional changes here, but saves some comments during reviews of new patches built on existing code. Signed-off-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org> Reviewed-by: "Rob Herring (Arm)" <robh@kernel.org> Link: https://lore.kernel.org/r/20250324125302.82167-1-krzysztof.kozlowski@linaro.org Signed-off-by: Georgi Djakov <djakov@kernel.org>
2025-04-15dt-bindings: interconnect: Add EPSS L3 compatible for SA8775PRaviteja Laggyshetty
Add Epoch Subsystem (EPSS) L3 interconnect provider binding on SA8775P SoCs. The L3 instance on the SA8775P SoC is similar to those on SoCs like SM8250 and SC7280. These SoCs use the PERF register instead of L3_REG for programming the performance level, which is managed in the data associated with the target-specific compatibles. Since the hardware remains the same across all EPSS-supporting SoCs, the generic compatible is retained for all SoCs. Reviewed-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org> Signed-off-by: Raviteja Laggyshetty <quic_rlaggysh@quicinc.com> Link: https://lore.kernel.org/r/20250415095343.32125-2-quic_rlaggysh@quicinc.com Signed-off-by: Georgi Djakov <djakov@kernel.org>
2025-01-14Merge branch 'icc-sm8750' into icc-nextGeorgi Djakov
Add interconnect support for SM8750 SoC. The Qualcomm Technologies, Inc. SM8750 SoC is the latest in the line of consumer mobile device SoCs. * icc-sm8750 dt-bindings: interconnect: add interconnect bindings for SM8750 interconnect: qcom: Add interconnect provider driver for SM8750 interconnect: sm8750: Add missing const to static qcom_icc_desc Link: https://lore.kernel.org/r/20241204-sm8750_master_interconnects-v3-0-3d9aad4200e9@quicinc.com Signed-off-by: Georgi Djakov <djakov@kernel.org>
2025-01-14dt-bindings: interconnect: qcom,msm8998-bwmon: Add SM8750 CPU BWMONsShivnandan Kumar
Document the SM8750 BWMONs, which has one instance per cluster of BWMONv4. Signed-off-by: Shivnandan Kumar <quic_kshivnan@quicinc.com> Signed-off-by: Melody Olvera <quic_molvera@quicinc.com> Link: https://lore.kernel.org/r/20250113-sm8750_bwmon_master-v1-1-f082da3a3308@quicinc.com Signed-off-by: Georgi Djakov <djakov@kernel.org>
2025-01-13dt-bindings: interconnect: OSM L3: Document sm8650 OSM L3 compatibleNeil Armstrong
Document the OSM L3 found in the Qualcomm SM8650 platform. Signed-off-by: Neil Armstrong <neil.armstrong@linaro.org> Acked-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org> Link: https://lore.kernel.org/r/20250110-topic-sm8650-ddr-bw-scaling-v1-1-041d836b084c@linaro.org Signed-off-by: Georgi Djakov <djakov@kernel.org>
2025-01-13dt-bindings: interconnect: qcom-bwmon: Document QCS615 bwmon compatiblesLijuan Gao
Document QCS615 BWMONs, which includes one BWMONv4 instance for CPU to LLCC path bandwidth monitoring and one BWMONv5 instance for LLCC to DDR path bandwidth monitoring. Signed-off-by: Lijuan Gao <quic_lijuang@quicinc.com> Reviewed-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org> Link: https://lore.kernel.org/r/20241218-add_bwmon_support_for_qcs615-v1-1-680d798a19e5@quicinc.com Signed-off-by: Georgi Djakov <djakov@kernel.org>
2024-12-17dt-bindings: interconnect: add interconnect bindings for SM8750Raviteja Laggyshetty
Add interconnect device bindings. These devices can be used to describe any RPMh and NoC based interconnect devices. Signed-off-by: Raviteja Laggyshetty <quic_rlaggysh@quicinc.com> Signed-off-by: Melody Olvera <quic_molvera@quicinc.com> Reviewed-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org> Link: https://lore.kernel.org/r/20241204-sm8750_master_interconnects-v3-1-3d9aad4200e9@quicinc.com Signed-off-by: Georgi Djakov <djakov@kernel.org>
2024-11-05Merge branch 'icc-sar2130p' into icc-nextGeorgi Djakov
Add driver for the network of connects present on the SAR2130P platform. * icc-sar2130p dt-bindings: interconnect: qcom: document SAR2130P NoC interconnect: qcom: add support for SAR2130P Link: https://lore.kernel.org/r/20241018-sar2130p-icc-v2-0-c58c73dcd19d@linaro.org Signed-off-by: Georgi Djakov <djakov@kernel.org>
2024-11-05Merge branch 'icc-qcs615' into icc-nextGeorgi Djakov
Add interconnect dt-bindings and driver support for Qualcomm QCS615 SoC. * icc-qcs615 dt-bindings: interconnect: document the RPMh Network-On-Chip interconnect in QCS615 SoC interconnect: qcom: add QCS615 interconnect provider driver Link: https://lore.kernel.org/r/20240924143958.25-1-quic_rlaggysh@quicinc.com Signed-off-by: Georgi Djakov <djakov@kernel.org>
2024-11-05Merge branch 'icc-qcs8300' into icc-nextGeorgi Djakov
Add interconnect support for QCS8300 SoC * icc-qcs8300 dt-bindings: interconnect: document the RPMh Network-On-Chip interconnect in QCS8300 SoC interconnect: qcom: add QCS8300 interconnect provider driver Link: https://lore.kernel.org/r/20240910101013.3020-1-quic_rlaggysh@quicinc.com Signed-off-by: Georgi Djakov <djakov@kernel.org>
2024-10-22dt-bindings: interconnect: qcom-bwmon: Document QCS8300 bwmon compatiblesJingyi Wang
Document QCS8300 BWMONs, which has two BWMONv4 instances for the CPU->LLCC path and one BWMONv5 instance for LLCC->DDR path. Signed-off-by: Jingyi Wang <quic_jingyw@quicinc.com> Reviewed-by: Krzysztof Kozlowski <krzk@kernel.org> Link: https://lore.kernel.org/r/20240925-qcs8300_bwmon_binding-v1-1-a7bfd94b2854@quicinc.com Signed-off-by: Georgi Djakov <djakov@kernel.org>
2024-10-22dt-bindings: interconnect: qcom: document SAR2130P NoCDmitry Baryshkov
Add bindings for the Network of Connects (NoC) present on the Qualcomm SAR2130P platform. Reviewed-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org> Signed-off-by: Dmitry Baryshkov <dmitry.baryshkov@linaro.org> Link: https://lore.kernel.org/r/20241018-sar2130p-icc-v2-1-c58c73dcd19d@linaro.org Signed-off-by: Georgi Djakov <djakov@kernel.org>
2024-10-22dt-bindings: interconnect: document the RPMh Network-On-Chip interconnect in ↵Raviteja Laggyshetty
QCS615 SoC Document the RPMh Network-On-Chip Interconnect of the QCS615 platform. Signed-off-by: Raviteja Laggyshetty <quic_rlaggysh@quicinc.com> Reviewed-by: Krzysztof Kozlowski <krzk@kernel.org> Link: https://lore.kernel.org/r/20240924143958.25-2-quic_rlaggysh@quicinc.com Signed-off-by: Georgi Djakov <djakov@kernel.org>
2024-10-22dt-bindings: interconnect: document the RPMh Network-On-Chip interconnect in ↵Raviteja Laggyshetty
QCS8300 SoC Document the RPMh Network-On-Chip Interconnect of the QCS8300 platform. Reviewed-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org> Signed-off-by: Raviteja Laggyshetty <quic_rlaggysh@quicinc.com> Link: https://lore.kernel.org/r/20240910101013.3020-2-quic_rlaggysh@quicinc.com Signed-off-by: Georgi Djakov <djakov@kernel.org>
2024-09-06Merge tag 'icc-6.12-rc1' of ↵Greg Kroah-Hartman
ssh://gitolite.kernel.org/pub/scm/linux/kernel/git/djakov/icc into char-misc-next Georgi writes: interconnect changes for 6.12 This pull request contains the interconnect changes for the 6.12-rc1 merge window. It contains new drivers and fixes with the following highlights: Driver changes: - New driver for MSM8976 platforms - New driver for MSM8937 platforms - Enable sync_state for SM8250 platforms - Enable QoS support for QCS404 - Add ab_coeff bandwidth adjustments for MSM8953 - Drop the unsupported yet DISP nodes on SM8350 platforms - Fix missed num_nodes initialization in icc-clk driver - Misc DT and documentation fixes Signed-off-by: Georgi Djakov <djakov@kernel.org> * tag 'icc-6.12-rc1' of ssh://gitolite.kernel.org/pub/scm/linux/kernel/git/djakov/icc: dt-bindings: interconnect: qcom: Do not require reg for sc8180x virt NoCs dt-bindings: interconnect: qcom-bwmon: Document SA8775p bwmon compatibles dt-bindings: interconnect: qcom: msm8953: Fix 'See also' in description interconnect: qcom: msm8953: Add ab_coeff dt-bindings: interconnect: qcom: msm8939: Fix example interconnect: qcom: qcs404: Add regmaps and more bus descriptions interconnect: qcom: qcs404: Mark AP-owned nodes as such interconnect: qcom: Add MSM8937 interconnect provider driver interconnect: qcom: sm8250: Enable sync_state dt-bindings: interconnect: qcom,sm8350: drop DISP nodes interconnect: qcom: sm8350: drop DISP nodes dt-bindings: interconnect: qcom: Add Qualcomm MSM8937 NoC interconnect: qcom: Add MSM8976 interconnect provider driver dt-bindings: interconnect: qcom: Add Qualcomm MSM8976 NoC interconnect: icc-clk: Add missed num_nodes initialization dt-bindings: interconnect: qcom,rpmh: correct sm8150 camnoc
2024-08-26Merge branch 'icc-misc' into icc-nextGeorgi Djakov
This series introduce new ICC drivers for some legacy socs while at it also updates a bit of qcs404 driver which seems to not receive much attention lately. * icc-misc dt-bindings: interconnect: qcom: Add Qualcomm MSM8976 NoC interconnect: qcom: Add MSM8976 interconnect provider driver dt-bindings: interconnect: qcom: Add Qualcomm MSM8937 NoC interconnect: qcom: Add MSM8937 interconnect provider driver interconnect: qcom: qcs404: Mark AP-owned nodes as such interconnect: qcom: qcs404: Add regmaps and more bus descriptions dt-bindings: interconnect: qcom: msm8939: Fix example interconnect: qcom: msm8953: Add ab_coeff dt-bindings: interconnect: qcom: msm8953: Fix 'See also' in description Link: https://lore.kernel.org/all/20240709102728.15349-1-a39.skl@gmail.com/ Signed-off-by: Georgi Djakov <djakov@kernel.org>
2024-08-26dt-bindings: interconnect: qcom: Do not require reg for sc8180x virt NoCsGeorgi Djakov
The virtual interconnect providers do not have their own IO address space, but this is not documented in the DT schema and the following warnings are reported by dtbs_check: sc8180x-lenovo-flex-5g.dtb: interconnect-camnoc-virt: 'reg' is a required property sc8180x-lenovo-flex-5g.dtb: interconnect-mc-virt: 'reg' is a required property sc8180x-lenovo-flex-5g.dtb: interconnect-qup-virt: 'reg' is a required property sc8180x-primus.dtb: interconnect-camnoc-virt: 'reg' is a required property sc8180x-primus.dtb: interconnect-mc-virt: 'reg' is a required property sc8180x-primus.dtb: interconnect-qup-virt: 'reg' is a required property Fix this by adding them to the list of compatibles that do not require the reg property. Link: https://lore.kernel.org/r/20240730141016.1142608-1-djakov@kernel.org Signed-off-by: Georgi Djakov <djakov@kernel.org>
2024-08-26dt-bindings: interconnect: qcom-bwmon: Document SA8775p bwmon compatiblesTengfei Fan
Document the compatibles used to describe the bwmons present on the SA8775p platform. Signed-off-by: Tengfei Fan <quic_tengfan@quicinc.com> Link: https://lore.kernel.org/r/20240730-add_sa8775p_bwmon-v1-1-f4f878da29ae@quicinc.com Signed-off-by: Georgi Djakov <djakov@kernel.org>
2024-08-24dt-bindings: interconnect: qcom: msm8953: Fix 'See also' in descriptionAdam Skladowski
"See also" in description seems to be wrongly defined, make it inline with other yamls. Fixes: 791ed23f735b ("dt-bindings: interconnect: qcom: Add Qualcomm MSM8953 NoC") Signed-off-by: Adam Skladowski <a39.skl@gmail.com> Acked-by: Rob Herring (Arm) <robh@kernel.org> Link: https://lore.kernel.org/r/20240709102728.15349-10-a39.skl@gmail.com Signed-off-by: Georgi Djakov <djakov@kernel.org>
2024-08-24dt-bindings: interconnect: qcom: msm8939: Fix exampleAdam Skladowski
For now example list snoc_mm as children of bimc which is obviously not valid, drop bimc and move snoc_mm into snoc. Signed-off-by: Adam Skladowski <a39.skl@gmail.com> Reviewed-by: Rob Herring (Arm) <robh@kernel.org> Reviewed-by: Konrad Dybcio <konrad.dybcio@linaro.org> Link: https://lore.kernel.org/r/20240709102728.15349-8-a39.skl@gmail.com Signed-off-by: Georgi Djakov <djakov@kernel.org>
2024-08-23dt-bindings: interconnect: qcom: Add Qualcomm MSM8937 NoCAdam Skladowski
Add bindings for Qualcomm MSM8937 Network-On-Chip interconnect devices. Signed-off-by: Adam Skladowski <a39.skl@gmail.com> Reviewed-by: Rob Herring (Arm) <robh@kernel.org> Link: https://lore.kernel.org/r/20240709102728.15349-4-a39.skl@gmail.com Signed-off-by: Georgi Djakov <djakov@kernel.org>
2024-08-23dt-bindings: interconnect: qcom: Add Qualcomm MSM8976 NoCAdam Skladowski
Add bindings for Qualcomm MSM8976 Network-On-Chip interconnect devices. Signed-off-by: Adam Skladowski <a39.skl@gmail.com> Reviewed-by: Rob Herring (Arm) <robh@kernel.org> Link: https://lore.kernel.org/r/20240709102728.15349-2-a39.skl@gmail.com Signed-off-by: Georgi Djakov <djakov@kernel.org>
2024-08-23dt-bindings: interconnect: qcom,rpmh: correct sm8150 camnocRayyan Ansari
The sm8150 camnoc interconnect was mistakenly documented as "qcom,sm8150-camnoc-noc", for which there is no reference to in drivers or device tree. Correct this to "qcom,sm8150-camnoc-virt". Signed-off-by: Rayyan Ansari <rayyan.ansari@linaro.org> Acked-by: Dmitry Baryshkov <dmitry.baryshkov@linaro.org> Reviewed-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org> Link: https://lore.kernel.org/r/20240716144738.109823-1-rayyan.ansari@linaro.org Signed-off-by: Georgi Djakov <djakov@kernel.org>
2024-07-29dt-bindings: Batch-update Konrad Dybcio's emailKonrad Dybcio
Use my @kernel.org address everywhere. Signed-off-by: Konrad Dybcio <konradybcio@kernel.org> Acked-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org> Link: https://lore.kernel.org/r/20240726-topic-konrad_email-v1-3-f94665da2919@kernel.org Signed-off-by: Rob Herring (Arm) <robh@kernel.org>
2024-07-19Merge tag 'char-misc-6.11-rc1' of ↵Linus Torvalds
git://git.kernel.org/pub/scm/linux/kernel/git/gregkh/char-misc Pull char / misc and other driver updates from Greg KH: "Here is the "big" set of char/misc and other driver subsystem changes for 6.11-rc1. Nothing major in here, just loads of new drivers and updates. Included in here are: - IIO api updates and new drivers added - wait_interruptable_timeout() api cleanups for some drivers - MODULE_DESCRIPTION() additions for loads of drivers - parport out-of-bounds fix - interconnect driver updates and additions - mhi driver updates and additions - w1 driver fixes - binder speedups and fixes - eeprom driver updates - coresight driver updates - counter driver update - new misc driver additions - other minor api updates All of these, EXCEPT for the final Kconfig build fix for 32bit systems, have been in linux-next for a while with no reported issues. The Kconfig fixup went in 29 hours ago, so might have missed the latest linux-next, but was acked by everyone involved" * tag 'char-misc-6.11-rc1' of git://git.kernel.org/pub/scm/linux/kernel/git/gregkh/char-misc: (330 commits) misc: Kconfig: exclude mrvl-cn10k-dpi compilation for 32-bit systems misc: delete Makefile.rej binder: fix hang of unregistered readers misc: Kconfig: add a new dependency for MARVELL_CN10K_DPI virtio: add missing MODULE_DESCRIPTION() macro agp: uninorth: add missing MODULE_DESCRIPTION() macro spmi: add missing MODULE_DESCRIPTION() macros dev/parport: fix the array out-of-bounds risk samples: configfs: add missing MODULE_DESCRIPTION() macro misc: mrvl-cn10k-dpi: add Octeon CN10K DPI administrative driver misc: keba: Fix missing AUXILIARY_BUS dependency slimbus: Fix struct and documentation alignment in stream.c MAINTAINERS: CC dri-devel list on Qualcomm FastRPC patches misc: fastrpc: use coherent pool for untranslated Compute Banks misc: fastrpc: support complete DMA pool access to the DSP misc: fastrpc: add missing MODULE_DESCRIPTION() macro misc: fastrpc: Add missing dev_err newlines misc: fastrpc: Use memdup_user() nvmem: core: Implement force_ro sysfs attribute nvmem: Use sysfs_emit() for type attribute ...
2024-07-04Merge branch 'icc-rpmh-qos' into icc-nextGeorgi Djakov
This series adds QoS support for QNOC type device which can be found on SC7280 platform. It adds support for programming priority, priority forward disable and urgency forwarding. This helps in priortizing the traffic originating from different interconnect masters at NOC (Network On Chip). * icc-rpmh-qos dt-bindings: interconnect: add clock property to enable QOS on SC7280 interconnect: qcom: icc-rpmh: Add QoS configuration support interconnect: qcom: sc7280: enable QoS configuration interconnect: qcom: Fix DT backwards compatibility for QoS Link: https://lore.kernel.org/r/20240607173927.26321-1-quic_okukatla@quicinc.com Signed-off-by: Georgi Djakov <djakov@kernel.org>
2024-07-04Merge branch 'icc-msm8953' into icc-nextGeorgi Djakov
Add interconnect driver for MSM8953-based devices. * icc-msm8953 dt-bindings: interconnect: qcom: Add Qualcomm MSM8953 NoC interconnect: qcom: Add MSM8953 driver Link: https://lore.kernel.org/r/20240628-msm8953-interconnect-v3-0-a70d582182dc@mainlining.org Signed-off-by: Georgi Djakov <djakov@kernel.org>
2024-06-28dt-bindings: interconnect: qcom: Add Qualcomm MSM8953 NoCVladimir Lypak
Add the device-tree bindings for interconnect providers used on MSM8953 platform. Signed-off-by: Vladimir Lypak <vladimir.lypak@gmail.com> Reviewed-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org> Signed-off-by: Barnabás Czémán <barnabas.czeman@mainlining.org> Link: https://lore.kernel.org/r/20240628-msm8953-interconnect-v3-1-a70d582182dc@mainlining.org Signed-off-by: Georgi Djakov <djakov@kernel.org>
2024-06-25dt-bindings: interconnect: qcom,msm8998-bwmon: Add X1E80100 BWMON instancesSibi Sankar
Document X1E80100 BWMONs, which has multiple (one per cluster) BWMONv4 instances for the CPU->LLCC path and one BWMONv5 instance for LLCC->DDR path. Reviewed-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org> Signed-off-by: Sibi Sankar <quic_sibis@quicinc.com> Acked-by: Georgi Djakov <djakov@kernel.org> Link: https://lore.kernel.org/r/20240624092214.146935-3-quic_sibis@quicinc.com Signed-off-by: Bjorn Andersson <andersson@kernel.org>
2024-06-25dt-bindings: interconnect: qcom,msm8998-bwmon: Remove opp-table from the ↵Sibi Sankar
required list Remove opp-table from the required list as the bindings shouldn't care where the OPP tables (referenced by the operating-points-v2 property) comes from. Suggested-by: Konrad Dybcio <konrad.dybcio@linaro.org> Signed-off-by: Sibi Sankar <quic_sibis@quicinc.com> Reviewed-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org> Acked-by: Georgi Djakov <djakov@kernel.org> Link: https://lore.kernel.org/r/20240624092214.146935-2-quic_sibis@quicinc.com Signed-off-by: Bjorn Andersson <andersson@kernel.org>
2024-06-24dt-bindings: interconnect: add clock property to enable QOS on SC7280Odelu Kukatla
Add clock property to enable the clocks required for accessing QoS configuration registers. Signed-off-by: Odelu Kukatla <quic_okukatla@quicinc.com> Acked-by: "Rob Herring (Arm)" <robh@kernel.org> Link: https://lore.kernel.org/r/20240607173927.26321-4-quic_okukatla@quicinc.com Signed-off-by: Georgi Djakov <djakov@kernel.org>