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2025-05-23cxl/edac: Add CXL memory device soft PPR control featureShiju Jose
Post Package Repair (PPR) maintenance operations may be supported by CXL devices that implement CXL.mem protocol. A PPR maintenance operation requests the CXL device to perform a repair operation on its media. For example, a CXL device with DRAM components that support PPR features may implement PPR Maintenance operations. DRAM components may support two types of PPR, hard PPR (hPPR), for a permanent row repair, and Soft PPR (sPPR), for a temporary row repair. Soft PPR is much faster than hPPR, but the repair is lost with a power cycle. During the execution of a PPR Maintenance operation, a CXL memory device: - May or may not retain data - May or may not be able to process CXL.mem requests correctly, including the ones that target the DPA involved in the repair. These CXL Memory Device capabilities are specified by Restriction Flags in the sPPR Feature and hPPR Feature. Soft PPR maintenance operation may be executed at runtime, if data is retained and CXL.mem requests are correctly processed. For CXL devices with DRAM components, hPPR maintenance operation may be executed only at boot because typically data may not be retained with hPPR maintenance operation. When a CXL device identifies error on a memory component, the device may inform the host about the need for a PPR maintenance operation by using an Event Record, where the Maintenance Needed flag is set. The Event Record specifies the DPA that should be repaired. A CXL device may not keep track of the requests that have already been sent and the information on which DPA should be repaired may be lost upon power cycle. The userspace tool requests for maintenance operation if the number of corrected error reported on a CXL.mem media exceeds error threshold. CXL spec 3.2 section 8.2.10.7.1.2 describes the device's sPPR (soft PPR) maintenance operation and section 8.2.10.7.1.3 describes the device's hPPR (hard PPR) maintenance operation feature. CXL spec 3.2 section 8.2.10.7.2.1 describes the sPPR feature discovery and configuration. CXL spec 3.2 section 8.2.10.7.2.2 describes the hPPR feature discovery and configuration. Add support for controlling CXL memory device soft PPR (sPPR) feature. Register with EDAC driver, which gets the memory repair attr descriptors from the EDAC memory repair driver and exposes sysfs repair control attributes for PRR to the userspace. For example CXL PPR control for the CXL mem0 device is exposed in /sys/bus/edac/devices/cxl_mem0/mem_repairX/ Add checks to ensure the memory to be repaired is offline and originates from a CXL DRAM or CXL gen_media error record reported in the current boot, before requesting a PPR operation on the device. Note: Tested with QEMU patch for CXL PPR feature. https://lore.kernel.org/linux-cxl/20250509172229.726-1-shiju.jose@huawei.com/T/#m70b2b010f43f7f4a6f9acee5ec9008498bf292c3 Reviewed-by: Dave Jiang <dave.jiang@intel.com> Reviewed-by: Jonathan Cameron <Jonathan.Cameron@huawei.com> Signed-off-by: Shiju Jose <shiju.jose@huawei.com> Reviewed-by: Alison Schofield <alison.schofield@intel.com> Acked-by: Dan Williams <dan.j.williams@intel.com> Link: https://patch.msgid.link/20250521124749.817-9-shiju.jose@huawei.com Signed-off-by: Dave Jiang <dave.jiang@intel.com>
2025-05-23cxl/edac: Add CXL memory device memory sparing control featureShiju Jose
Memory sparing is defined as a repair function that replaces a portion of memory with a portion of functional memory at that same DPA. The subclasses for this operation vary in terms of the scope of the sparing being performed. The cacheline sparing subclass refers to a sparing action that can replace a full cacheline. Row sparing is provided as an alternative to PPR sparing functions and its scope is that of a single DDR row. As per CXL r3.2 Table 8-125 foot note 1. Memory sparing is preferred over PPR when possible. Bank sparing allows an entire bank to be replaced. Rank sparing is defined as an operation in which an entire DDR rank is replaced. Memory sparing maintenance operations may be supported by CXL devices that implement CXL.mem protocol. A sparing maintenance operation requests the CXL device to perform a repair operation on its media. For example, a CXL device with DRAM components that support memory sparing features may implement sparing maintenance operations. The host may issue a query command by setting query resources flag in the input payload (CXL spec 3.2 Table 8-120) to determine availability of sparing resources for a given address. In response to a query request, the device shall report the resource availability by producing the memory sparing event record (CXL spec 3.2 Table 8-60) in which the Channel, Rank, Nibble Mask, Bank Group, Bank, Row, Column, Sub-Channel fields are a copy of the values specified in the request. During the execution of a sparing maintenance operation, a CXL memory device: - may not retain data - may not be able to process CXL.mem requests correctly. These CXL memory device capabilities are specified by restriction flags in the memory sparing feature readable attributes. When a CXL device identifies error on a memory component, the device may inform the host about the need for a memory sparing maintenance operation by using DRAM event record, where the 'maintenance needed' flag may set. The event record contains some of the DPA, Channel, Rank, Nibble Mask, Bank Group, Bank, Row, Column, Sub-Channel fields that should be repaired. The userspace tool requests for maintenance operation if the 'maintenance needed' flag set in the CXL DRAM error record. CXL spec 3.2 section 8.2.10.7.1.4 describes the device's memory sparing maintenance operation feature. CXL spec 3.2 section 8.2.10.7.2.3 describes the memory sparing feature discovery and configuration. Add support for controlling CXL memory device memory sparing feature. Register with EDAC driver, which gets the memory repair attr descriptors from the EDAC memory repair driver and exposes sysfs repair control attributes for memory sparing to the userspace. For example CXL memory sparing control for the CXL mem0 device is exposed in /sys/bus/edac/devices/cxl_mem0/mem_repairX/ Use case ======== 1. CXL device identifies a failure in a memory component, report to userspace in a CXL DRAM trace event with DPA and other attributes of memory to repair such as channel, rank, nibble mask, bank Group, bank, row, column, sub-channel. 2. Rasdaemon process the trace event and may issue query request in sysfs check resources available for memory sparing if either of the following conditions met. - 'maintenance needed' flag set in the event record. - 'threshold event' flag set for CVME threshold feature. - When the number of corrected error reported on a CXL.mem media to the userspace exceeds the threshold value for corrected error count defined by the userspace policy. 3. Rasdaemon process the memory sparing trace event and issue repair request for memory sparing. Kernel CXL driver shall report memory sparing event record to the userspace with the resource availability in order rasdaemon to process the event record and issue a repair request in sysfs for the memory sparing operation in the CXL device. Note: Based on the feedbacks from the community 'query' sysfs attribute is removed and reporting memory sparing error record to the userspace are not supported. Instead userspace issues sparing operation and kernel does the same to the CXL memory device, when 'maintenance needed' flag set in the DRAM event record. Add checks to ensure the memory to be repaired is offline and if online, then originates from a CXL DRAM error record reported in the current boot before requesting a memory sparing operation on the device. Note: Tested memory sparing feature control with QEMU patch "hw/cxl: Add emulation for memory sparing control feature" https://lore.kernel.org/linux-cxl/20250509172229.726-1-shiju.jose@huawei.com/T/#m5f38512a95670d75739f9dad3ee91b95c7f5c8d6 Reviewed-by: Jonathan Cameron <Jonathan.Cameron@huawei.com> Reviewed-by: Dave Jiang <dave.jiang@intel.com> Signed-off-by: Shiju Jose <shiju.jose@huawei.com> Reviewed-by: Alison Schofield <alison.schofield@intel.com> Acked-by: Dan Williams <dan.j.williams@intel.com> Link: https://patch.msgid.link/20250521124749.817-8-shiju.jose@huawei.com Signed-off-by: Dave Jiang <dave.jiang@intel.com>
2025-05-23EDAC: Update documentation for the CXL memory patrol scrub control featureShiju Jose
Update the Documentation/edac/scrub.rst to include use cases and policies for CXL memory device-based, CXL region-based patrol scrub control and CXL Error Check Scrub (ECS). Reviewed-by: Dave Jiang <dave.jiang@intel.com> Reviewed-by: Jonathan Cameron <Jonathan.Cameron@huawei.com> Signed-off-by: Shiju Jose <shiju.jose@huawei.com> Reviewed-by: Fan Ni <fan.ni@samsung.com> Reviewed-by: Alison Schofield <alison.schofield@intel.com> Acked-by: Dan Williams <dan.j.williams@intel.com> Link: https://patch.msgid.link/20250521124749.817-2-shiju.jose@huawei.com Signed-off-by: Dave Jiang <dave.jiang@intel.com>
2025-02-26EDAC: Add a memory repair control featureShiju Jose
Add a generic EDAC memory repair control driver to manage memory repairs in the system, such as CXL Post Package Repair (PPR) and other soft and hard PPR features. For example, a CXL device with DRAM components that support PPR features may implement PPR maintenance operations. DRAM components may support two types of PPR: - hard PPR, for a permanent row repair, and - soft PPR, for a temporary row repair. Soft PPR is much faster than hard PPR, but the repair is lost with a power cycle. When a CXL device detects an error in a memory, it may report the need for a repair maintenance operation by using an event record where the "maintenance needed" flag is set. The event records contain the device physical address (DPA) and other optional attributes of the memory to repair. The kernel will report the corresponding CXL general media or DRAM trace event to userspace, and userspace tools (e.g. rasdaemon) will initiate a repair operation in response to the device request via the sysfs repair control. Device with memory repair features registers with EDAC device driver, which retrieves a memory repair descriptor from EDAC memory repair driver and exposes the sysfs repair control attributes to userspace in /sys/bus/edac/devices/<dev-name>/mem_repairX/. The common memory repair control interface abstracts the control of arbitrary memory repair functionality into a standardized set of functions. The sysfs memory repair attribute nodes are only available if the client driver has implemented the corresponding attribute callback function and provided operations to the EDAC device driver during registration. [ bp: Massage, fixup edac_dev_register() retvals, merge write_overflow fix to mem_repair_create_desc() ] Signed-off-by: Shiju Jose <shiju.jose@huawei.com> Signed-off-by: Borislav Petkov (AMD) <bp@alien8.de> Link: https://lore.kernel.org/r/20250212143654.1893-5-shiju.jose@huawei.com
2025-02-25EDAC: Add a Error Check Scrub control featureShiju Jose
Add an Error Check Scrub (ECS) control to manage a memory device's ECS feature. The ECS is a feature defined in JEDEC DDR5 SDRAM Specification (JESD79-5) and allows the DRAM to internally read, correct single-bit errors, and write back corrected data bits to the DRAM array while providing transparency to error counts. The DDR5 device contains a number of memory media Field Replaceable Units (FRU) per device. The DDR5 ECS feature and thus the ECS control driver supports configuring the ECS parameters per FRU. Memory devices support the ECS feature register with the EDAC device driver, which retrieves the ECS descriptor from the EDAC ECS driver. This driver exposes sysfs ECS control attributes to userspace via /sys/bus/edac/devices/<dev-name>/ecs_fruX/. The common sysfs ECS control interface abstracts the control of an arbitrary ECS functionality to a common set of functions. Support for the ECS feature is added separately because the control attributes of the DDR5 ECS feature differ from those of the scrub feature. The sysfs ECS attribute nodes are only present if the client driver has implemented the corresponding attribute callback function and passed the necessary operations to the EDAC RAS feature driver during registration. [ bp: Massage, fixup edac_dev_register() retvals. ] Co-developed-by: Jonathan Cameron <Jonathan.Cameron@huawei.com> Signed-off-by: Jonathan Cameron <Jonathan.Cameron@huawei.com> Signed-off-by: Shiju Jose <shiju.jose@huawei.com> Signed-off-by: Borislav Petkov (AMD) <bp@alien8.de> Reviewed-by: Fan Ni <fan.ni@samsung.com> Tested-by: Fan Ni <fan.ni@samsung.com> Link: https://lore.kernel.org/r/20250212143654.1893-4-shiju.jose@huawei.com
2025-02-25EDAC: Add scrub control featureShiju Jose
Add a scrub control to manage memory scrubbers in the system. Devices with a scrub feature register with the EDAC device driver which retrieves the scrub descriptor from the scrub driver and exposes the control attributes for a instance to userspace at /sys/bus/edac/devices/<dev-name>/scrubX/. The common sysfs scrub control interface abstracts the control of arbitrary scrubbing functionality into a common set of functions. The attribute nodes are only present if the client driver has implemented the corresponding attribute callback function and passed the operations to the device driver during registration. [ bp: Massage commit message, docs and code, simplify text a bit. Integrate fixup for: https://lore.kernel.org/r/202502251009.0sGkolEJ-lkp@intel.com Reported-by: kernel test robot <lkp@intel.com> Reported-by: Dan Carpenter <dan.carpenter@linaro.org> ] Co-developed-by: Jonathan Cameron <Jonathan.Cameron@huawei.com> Signed-off-by: Jonathan Cameron <Jonathan.Cameron@huawei.com> Signed-off-by: Shiju Jose <shiju.jose@huawei.com> Signed-off-by: Borislav Petkov (AMD) <bp@alien8.de> Tested-by: Daniel Ferguson <danielf@os.amperecomputing.com> Tested-by: Fan Ni <fan.ni@samsung.com> Link: https://lore.kernel.org/r/20250212143654.1893-3-shiju.jose@huawei.com
2025-02-25EDAC: Add support for EDAC device features controlShiju Jose
Add generic EDAC device feature controls supporting the registration of RAS features available in the system. The driver exposes control attributes for these features to userspace in /sys/bus/edac/devices/<dev-name>/<ras-feature> [ bp: Touch-up documentation, simplify, make edac_dev_type static, fixup edac_dev_register() retvals. ] Co-developed-by: Jonathan Cameron <Jonathan.Cameron@huawei.com> Signed-off-by: Jonathan Cameron <Jonathan.Cameron@huawei.com> Signed-off-by: Shiju Jose <shiju.jose@huawei.com> Signed-off-by: Borislav Petkov (AMD) <bp@alien8.de> Reviewed-by: Fan Ni <fan.ni@samsung.com> Tested-by: Daniel Ferguson <danielf@os.amperecomputing.com> Tested-by: Fan Ni <fan.ni@samsung.com> Link: https://lore.kernel.org/r/20250212143654.1893-2-shiju.jose@huawei.com